Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...

Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. Abstract “Memory-centric computing aims to ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...

A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec.

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

A new technical paper titled “Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical ...

Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...