Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
Micron also makes memory chips for artificial intelligence (AI) and other enterprise applications. Within the category, the company's high-bandwidth memory (HBM) offerings have emerged as a key growth ...
The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...
Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...
While PCs, servers, and smartphones can make do with standard memory chips, AI accelerators generally use high-bandwidth memory (HBM). As such, HBM is in high demand, and memory chip manufacturers ...
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Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...